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Factbox: A look inside Apple's new iPhone 5S and 5C

Handout image released by iFixit.com shows a disassembled Apple iPhone 5S handset during a product teardown in Melbourne, Australia September 20, 2013. Watermark added at source. REUTERS/iFixIt.com/Handout via Reuters

(Reuters) - Apple Inc's newest smartphone models hit stores on Friday in many countries across the world, including Australia and China. For the first time, Apple is selling a second smartphone dubbed the "5C" featuring a plastic back and bright colors. The pricier "5S" now comes in three new colors - gray, silver and gold. Technology firm iFixit disassembled a gold-colored iPhone 5S and examined its parts and then took apart a 5C model. Following are some of the key parts for the 5S model: * Chips from Avago Technologies Ltd and Skyworks Solutions Inc are featured in the iPhone5S. * Companies supplying parts for the new phone also include South Korean memory chipmaker SK Hynix Inc and radio-frequency chipmaker TriQuint Semiconductor Inc. * Broadcom Corp's BCM5976 chip is used for the touchscreen controller. * Murata Manufacturing Co's 339S0205 (based on the Broadcom BCM4334) Wi-Fi module. * Includes chips from Qualcomm Inc (PM8018 RF power management IC) and Texas Instruments Inc. Following are some key points of the 5C model: * The hardware design on the 5C appears more similar to the 5S than to the iPhone 5 * The 5C uses a Toshiba Corp 16 gigabyte flash memory chip Information is from iFixit, a web site offering parts and self-repair guides for Apple iPods and Macintosh computers. (Reporting By Richard Pullin and Poornima Gupta; Editing by Ian Geoghegan)